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Pb Free Plating Product
CORPORATION
G3401
P-CHANNEL ENHANCEMENT MODE POWER MOSFET
ISSUED DATE :2006/08/31 REVISED DATE :
BVDSS RDS(ON) ID
-30V 50m -4.2A
Description
The G3401 uses advanced trench technology to provide excellent on-resistance extremely efficient and cost-effectiveness device. The G3401 is universally used for all commercial-industrial applications. *Lower Gate Charge *Small Package Outline *RoHS Compliant
Features
Package Dimensions
REF. A B C D E F
Millimeter Min. Max. 2.70 3.10 2.40 2.80 1.40 1.60 0.35 0.50 0 0.10 0.45 0.55
REF. G H K J L M
Millimeter Min. Max. 1.90 REF. 1.00 1.30 0.10 0.20 0.40 0.85 1.15 0 10
Absolute Maximum Ratings
Parameter Drain-Source Voltage Gate-Source Voltage 3 Continuous Drain Current 3 Continuous Drain Current Pulsed Drain Current1 Power Dissipation Linear Derating Factor
Operating Junction and Storage Temperature Range
Symbol VDS VGS ID @TA=25 : ID @TA=70 : IDM PD @TA=25 : Tj, Tstg Symbol Rthj-a
Ratings -30 12 -4.2 -3.5 -30 1.38 0.01 -55 ~ +150 Ratings 90
Unit V V A A A W W/ : : Unit : /W
Thermal Data
Parameter 3 Thermal Resistance Junction-ambient Max.
G3401
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CORPORATION
Electrical Characteristics (Tj = 25 : unless otherwise specified)
Parameter Drain-Source Breakdown Voltage Gate Threshold Voltage Forward Transconductance Gate-Source Leakage Current
Drain-Source Leakage Current(Tj=25 : ) Drain-Source Leakage Current(Tj=55 : )
ISSUED DATE :2006/08/31 REVISED DATE :
Symbol BVDSS VGS(th) gfs IGSS IDSS
Min. -30 -0.7 -
Typ. 11 9.4 2 3 6.3 3.2 38.2 12 954 115 77 6
Max. -1.3 100 -1 -5 50 65 120 -
Unit V V S nA uA uA
Test Conditions VGS=0, ID=-250uA VDS=VGS, ID=-250uA VDS=-5V, ID=-5A VGS= 12V VDS=-24V, VGS=0 VDS=-24V, VGS=0 VGS=-10V, ID=-4.2A
Static Drain-Source On-Resistance
RDS(ON)
-
m
VGS=-4.5V, ID=-4.0A VGS=-2.5V, ID=-1.0A ID=-4A VDS=-15V VGS=-4.5V VDS=-15V VGS=-10V RG=6 RL=3.6 VGS=0V VDS=-15V f=1.0MHz f=1.0MHz
Total Gate Charge
2
Qg Qgs Qgd Td(on) Tr Td(off) Tf Ciss Coss Crss Rg Symbol VSD
2
-
Gate-Source Charge Gate-Drain ("Miller") Change Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
2
nC
ns
pF
Source-Drain Diode
Parameter Forward On Voltage
2
Min. -
Typ. 20.2 11.2 -
Max. -1.0 -2.2
Unit V ns nC A
Test Conditions IS=-1.0A, VGS=0V IS=-4A, VGS=0V dI/dt=100A/ s VD=VG=0V, VS=-1.0V
Reverse Recovery Time
Trr Qrr IS
Reverse Recovery Charge
Continuous Source Current (Body Diode)
Notes: 1. Pulse width limited by Max. junction temperature. 2. Pulse width 300us, duty cycle 2%. 3. Surface mounted on 1 in2 copper pad of FR4 board; 270 : /W when mounted on Min. copper pad.
G3401
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CORPORATION
Characteristics Curve
ISSUED DATE :2006/08/31 REVISED DATE :
Fig 1. Typical Output Characteristics
Fig 2. Transfer Characteristics
Fig 3. On-Resistance v.s. Drain Current and Gate Voltage
10 1 0.1 0.01 0.001 0.0001 0.00001 0.000001
Fig 4. On-Resistance v.s. Junction Temperature
Fig 5. On-Resistance v.s. Gate-Source Voltage
Fig 6. Body Diode Characteristics
G3401
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CORPORATION
ISSUED DATE :2006/08/31 REVISED DATE :
Fig 7. Maximum Safe Operating Area
Fig 8. Single Pulse Power Rating Junction-to-Ambient v.s. Junction Temperature
Fig 9. Gate Charge Characteristics
Fig 10. Typical Capacitance Characteristics
Fig 11. Normalized Maximum Transient Thermal Impedance Curve
Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM. GTM reserves the right to make changes to its products without notice. GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems. GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Taiwan: No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C. TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785 China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165
G3401
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